SMT manufacturing

From large-scale series production to the production of a minimum number of samples. In SMT manufacturing, our specialists build and manage the production process based on experience in complex product manufacturing, ensuring delivery to your requirements.

Our SMT production line is fully automated, guaranteeing total avoidance of component damage. We handle the most sensitive ICs and BGAs with our high level ESD system. From part size 0201 up to 88x88mm, we perform automatic placing and examination of surface-mounted and through-hole components. We handle a wide range of printed circuits from 50 mm to 500 mm width and length.

Our SMT production line configuration:

  • Automatic PCB handling in magazine (ASYS, Rommel)
  • Automatic paste printer (EKRA)
  • 3D paste inspection (KohYoung)
  • Automatic pick-and-place – from reel, tray or pipe (Siemens)
  • Reflow oven with nitrogen atmosphere (Rehm)
  • FIFO feeding (ASYS)
  • AOI (VISCOM, VI)
  • Visual inspection (Optilia system)
  • Labelling (Zebra)
  • Laser engraving

TH Technology

Assembly and soldering of axial and radial parts. Parts can be assembled manually or using a machine, depending on product requirements. Soldering can be carried out by using selective automated equipment that complies with car industry standards (process camera, automatic wave level regulation, soldering in nitrogen atmosphere). Thanks to the selective soldering technology, not only soldering but also flux application takes place selectively, which minimises the final product’s flux contamination. A semi-automatic cleaning equipment in installed to clean the products, which is suitable to achieve the highest level of panel cleanness, so as to ensure the best possible conditions for varnishing.

Prototype Manufacturing

We carry out complete sample production of complete items, series production in small and large series. We create the conditions for efficient production by making prototypes and samples. From the initial idea to the tested and approved product, production is flexible, fast and innovative, while meeting the highest quality standards. We pay particular attention to coordinated technological understanding and agreement in our assignments.

Manual Assembling and Repair

Individual operations during final assembly are carried out manually or semi-automatically, such as screwing, wire soldering, boxing, testing, etc. Manual assembly is a flexible and environmentally friendly way to manufacture printed circuit boards to a high quality. We support our partners in maximising the technology in the production process, optimising budgets and achieving the highest quality. In addition to in-production inspections, we also perform 100% visual final inspection of all our products to ensure high quality, by our IPC-A-610 certified experts.

BGA repair

More complex assemblies with special SMD components (such as BGA or QFP) are repaired with a rework station. This allows for targeted removal or replacement of faulty components. We carry out QFP, QFN, BGA soldering, factory reject repair, BGA replacement, rework. Thanks to our X-ray inspection, we can 100% verify our repairs, and our ESD system allows us to work with sensitive components.

Manufacturing, Part Process

PCB washing:
with our DCT INJET semi-automatic equipment, the flux residues generated during manual or wave soldering as well as other smaller impurities can be completely removed from the PCB surface, thereby ensuring long-lasting and high-quality varnishing.

Coating:
We work with acrylic and silicone-based materials of varying micron thicknesses, which are applied to products to prevent corrosion and other chemical damage from extreme conditions of use.

Glueing, fixture:
We equip different size of SMT (e.g. socket) ad TH (large size condenser) parts with extra physical fixture, which can relieve the soldering of the parts in case of physical load. It is recommended for large parts and for products exposed to high acceleration.

Inspections

Optical inspection

100% optical inspection of externally manufactured products. Our automatic optical inspection machines performs fully automated inspections by unloading from magazine and loading into the magazine after the inspection, concerning a particular error image of even a complete product.

X-RAY inspection

Viscom X7056RS – A high-performance test system, which examines automated optical (AOI) and automated X-ray (AXI) at the same time. As result the mistakes of the hidden soldering points (ex. BGA) can be detected reliably.
Our equipment is reliable, and provides fast in-line control with the help of the conveyor system belonging to this machine.

With our DMC/QR code reader at the delivery conveyor system – before the X7056RS machine in our production line – the identification of the inspected products is insured. After scanning the DMC/QR code on the workstation following the equipment, the error image of the product is displayed on the monitor. Due to the unique identification of the PCB-s, all results of the inspected products can be retrievable.

The X7056 system is totally modular, can be used as combined system (AOXI) or as an equipment under X-ray control (AXI).

Failure analyses to identify manufacturing problems:

  • Tombstoning of resistances
  • QFP soldering errors
  • PAD wetting faults
  • BGA faults, etc.

Analytical methods:

  • Optical microscope
  • X-RAY microscope
  • Cross stitch – the cross section is intended for a flat surface with minimal surface roughness, in order to explore the internal structure of the sample
  • Shear testing –shear strength of BGA balls
  • BGA dyeing test: An analytical method using a special colouring fluid relying on the existing cracks in the BGA spheres
  • Electron microscope – allows large, grayscale micrographs of the surface of the sample up to 100,000x magnification.